#Reflow profile how to
#Reflow profile generator
#Reflow profile software

Owing to an increase in market competition, modern electronics manufacturers are focusing on optimizing the cost, size, and manufacturing process of electronics assemblies. Some state-of-the-art products of Techspray will be highlighted to aid engineers to achieve optimal reflow profiles and fault-free PCBAs.

#Reflow profile how to

To educate PCB design engineers, this article aims to elaborate how to achieve optimal solder reflow profiles and avoid common Printed Circuit Board Assembly (PCBA) defects, e.g., bridging, tombstoning, beading, and cracking during manufacturing. With the increasing use of Surface Mount Technology (SMT) most defects in new electronics assemblies are credited to unoptimized solder reflow profiles.

#Reflow profile generator

If using a reflow oven recipe generator check that it also considers the convection rate.Faulty or damaged electronics assemblies obtained after batch processing is a big setback for not only the electronics manufacturers who are competing in the market, but also for the process engineers.

#Reflow profile software

Many reflow ovens employ automated recipe generator software tools to facilitate the development of oven recipes. The pressure is adjusted by the control of the fan speed in each heated plenum. Convection rates are adjusted by setting the pressure in the heated air plenum in each zone. In a convection solder reflow oven convection is the dominant component of heat transfer. Modern reflow ovens used for mass production also have the ability to control convection rate – the speed at which the hot gases hit the product. Solder reflow ovens control the temperature profile by adjustments to the zone temperature set points and the belt speed. Controlling the Solder Reflow Oven Temperature Profile The reflow oven profile will be compared to solder specifications and board/component limitations including: ramp rates, peak temperature, TAL (time above liquidus) and other factors. time data can also be downloaded as a table and can be manipulated by MS Excel or other statistical programs. The measured reflow oven profile is often displayed visually, as a graph, but the raw temperature vs. The profiles can be measured in a loaded or unloaded state by either processing boards ahead of and behind the thermocoupled board to simulate the load or by sending the thermocouple board through alone for an unloaded test. The attached thermocouples can be measured by trailing the wires through the oven while processing or using a recording device that can be passed through the reflow oven by use of an insulating cover. Placing multiple thermocouples in differing locations and on different types of components on the board will give you the most comprehensive understanding of the thermal profile. Best practices for attaching thermocouples also suggest using strain relief to prevent the TC’s from being pulled off the board when the wires are tugged. Aluminum or Kapton tape can be used to attach thermocouples, but is not suggested due to trapped air and loosening of the tape’s adhesive. These thermocouples are attached using solder or epoxy. How to Profile a Solder Reflow OvenĪ solder reflow oven is profiled by attaching thermocouples (TC’s) to the board that is being processed.

The difference between the reflow oven set points, or recipe, and the thermal profile is governed by the laws of heat transfer and is affected by mass (weight of the product), surface area, thickness, and the heat capacity (the ability of a material to absorb or give up heat). The temperature settings combined with the belt speed, and the convection rate settings, will produce the thermal profile on the board or product. The recipe is the temperature settings of the reflow oven in each zone.

A thermal profile is a measurement of the temperature, of the product, during thermal processing. The thermal profile is an critical consideration in the solder reflow process.